ARIKAWA SHUICHI
Department Undergraduate School , School of Science and Technology Position Associate Professor |
|
Date | 2016/11 |
Presentation Theme | Thermal Strain Measurement of Electronic Package Using Digital Image Correlation with Periodical Error Elimination |
Conference | 11th International Symposium on Advanced Science and Technology in Experimental Mechanics |
Conference Type | International |
Presentation Type | Speech (General) |
Contribution Type | Collaborative |
Country | Viet Nam |
Venue | Ho Chi Minh |
Publisher and common publisher | Y. Fujimoto, S. Arikawa, M. Murata and S. Yoneyama |