ARIKAWA SHUICHI
Department Undergraduate School , School of Science and Technology Position Associate Professor |
|
Date | 2015/09 |
Presentation Theme | Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation |
Conference | International Conference on Advanced Technology in Experimental Mechanics 2015 |
Conference Type | International |
Presentation Type | Speech (General) |
Contribution Type | Collaborative |
Venue | Toyohashi |
Publisher and common publisher | Y. Fujimoto, S. Arikawa, R. Yoshida, Y. Omoto and S. Yoneyama |