(Last updated : 2024-09-06 11:50:17)
  KATSUMATA Hiroshi
   Department   Undergraduate School  , School of Science and Technology
   Position   Associate Professor
■ Books and Papers
1. 2021/11 Article Evaluation of Insulating Magnetic Materials Composed of Epoxy Resin and Pure Iron Powder for Motor and Reactor Core Applications IEEJ Journal of Industry Applications 10(6),pp.606-611 (Collaboration) 
2. 2020/12 Article Evaluation of Insulating Magnetic Materials Composed of Epoxy Resin and Pure Iron Powder for Motor and Reactor Core Applications Proceedings of the 23rd International Conference on Electrical Machines and Systems pp.139-144 (Collaboration) 
3. 2020/08 Article Formation of Mg2Si1-xSnx Thin Films by Co-sputtering and Investigation of their p-type Electrical Conduction Japanese Journal of Applied Physics, Conference Proceedings 8,pp.011003-1-011003-8 (Collaboration) 
4. 2020/08 Article Structural, Optical and AC Conductivity Studies on Polycrystalline-Si/Nanocrystalline-FeSi2 Composite Thin Films Japanese Journal of Applied Physics, Conference Proceedings 8,pp.011301-1-011301-6 (Collaboration) 
5. 2016/06 Article Preparation of β-FeSi2 by plasma activated sintering of
mechanically milled powders and its application Materials Science and Technology of Japan pp.78-81 (Collaboration) 
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■ Conference Presentations
1. 2023/11/13 Evaluation of the Effects of Structural Parameters on External Quantum Efficiency of Si/Mg2Si Heterojunction Photodiodes Using Device Simulation (TACT2023 International Thin Films Conference (C-P-164))
2. 2023/11/13 Impact of Interfacial SiO2 Layers on the Photovoltaic Characteristics of n-type Nanocrystalline β‐FeSi2 Embedded in Polycrystalline Si Formed on p-type Si Substrates (TACT2023 International Thin Films Conference (B-P-80))
3. 2023/11/13 Optical and Electrical Properties of SiC Added SiOx Films for Light Emitting and Sensing Devices (TACT2023 International Thin Films Conference (B-P-161))
4. 2023/11/13 The Influence of Ar-N2/O2 Flow Ratio on the Types of Electrical Conductivity in Cu and N co-doped ZnO Films formed by RF Magnetron Co-Sputtering (TACT2023 International Thin Films Conference (C-P-134))
5. 2022/07/31 Correlation between Plasma Color and Properties of Mg2Si Thin Films formed by RF Magnetron Sputtering (6th Asia-Pacific Conference on Semiconducting Silicides (APAC SILICIDE 2022) (P-II-12, pp.151-15))
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■ Academic Qualifications
1. 1988/04~1992/03 Faculty of Engineering, Meiji University, Graduated,
2. 1992/04~1994/03 〔Master Course〕, Graduate School, Division of Engineering, Meiji University, Completed,
3. 1994/04~1997/03 〔Doctorial Course〕, Meiji University, Completed,
4. 1997/03/26
Degree Acquisition
Meiji University,
■ Career History
1. 1997/04~2000/03 Kyoto University Ion Beam Engineering Experimental Laboratory
2. 2000/04~2010/03 TOSHIBA Corporation Corporate Manufacturing Engineering Center
■ Major Subjects
electromagnetism, electronic device
■ Academic Associations Membership
1. 2011/01~ Materials Research Society
■ Web Sites
   Optobioelectronics Laboratory
■ Award History
1. 2023/11 Poster Award of Excellence, International Thin Films Conference (TACT2023), GIS TAIPE TECH Convention Center
2. 2015/11 Poster Award of Merit, International Thin Films Conference (TACT2015), National Cheng Kung University, Tainan, Taiwan
3. 2011/08 Best Poster Report Award, Asian School-Conference on Physics and Technology of Nanostructured Materials (ASCO-NANOMAT), Vladivostok, Russia
4. 2000/11 R.F.Bunshah Award for the Best Paper at 27th International Conference on Metallurgical Coatings and Thin Films, American Vacuum Society.
■ Current Specialized Field
Electric and electronic materials (Key Word:Semiconducting slicide, Nanocrystal, Wide band-gap semiconductor) 
■ Patents
1. Method of manufacturing oxide film and method of manufacturing semiconductor device
2. 2010/01/13 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
3. 2010/11/16 Method of manufacturing semiconductor device, apparatus of manufacturing semiconductor device and semiconductor device
4. METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT