YOKOGAWA RYO
   Department   Undergraduate School  , School of Science and Technology
   Position   Assistant Professor
Language English
Publication Date 2019/06
Type International Conference
Peer Review Peer reviewed
Title Ultra-Thin Lightweight Bendable Crystalline Si Solar Cells for Solar Vehicles
Contribution Type Co-authored (other than first author)
Journal Conference Record of the IEEE Photovoltaic Specialists Conference
Journal TypeAnother Country
Volume, Issue, Page pp.1131-1134
Author and coauthor Yoshio Ohshita, Kohei Onishi, Ryo Yokogawa, Tappei Nishihara, Takefumi Kamioka, Kyotaro Nakamura, Tomoyuki Kawatsu, Toshiki Nagai, Noboru Yamada, Yukio Miyashita, Atsushi Ogura
Details © 2019 IEEE. Komatsu NTC developed ultra-thin wafer slicing with low kerf-loss by multi diamond-wire saw. We modified slicing conditions and diamond-wire specifications to keep the straightness of wire for the fine pitch slicing and established 150 μm pitch slicing technology. The as-cut wafer thickness is 90 μm, and the kerf-loss is 60 μm. As a result, the highly flexible ultrathin wafer can be obtained with well-controlled surface crystallinity. The PERT cell fabrication trial using ultra-thin wafers showed that the relative deference of cell efficiency between 166 μm thick and 84 μm thick solar cells was just only 1.2%.
DOI 10.1109/PVSC40753.2019.8981291
ISSN 0160-8371