YOKOGAWA RYO
Department Undergraduate School , School of Science and Technology Position Assistant Professor |
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Language | English |
Publication Date | 2019/06 |
Type | International Conference |
Peer Review | Peer reviewed |
Title | Ultra-Thin Lightweight Bendable Crystalline Si Solar Cells for Solar Vehicles |
Contribution Type | Co-authored (other than first author) |
Journal | Conference Record of the IEEE Photovoltaic Specialists Conference |
Journal Type | Another Country |
Volume, Issue, Page | pp.1131-1134 |
Author and coauthor | Yoshio Ohshita, Kohei Onishi, Ryo Yokogawa, Tappei Nishihara, Takefumi Kamioka, Kyotaro Nakamura, Tomoyuki Kawatsu, Toshiki Nagai, Noboru Yamada, Yukio Miyashita, Atsushi Ogura |
Details | © 2019 IEEE. Komatsu NTC developed ultra-thin wafer slicing with low kerf-loss by multi diamond-wire saw. We modified slicing conditions and diamond-wire specifications to keep the straightness of wire for the fine pitch slicing and established 150 μm pitch slicing technology. The as-cut wafer thickness is 90 μm, and the kerf-loss is 60 μm. As a result, the highly flexible ultrathin wafer can be obtained with well-controlled surface crystallinity. The PERT cell fabrication trial using ultra-thin wafers showed that the relative deference of cell efficiency between 166 μm thick and 84 μm thick solar cells was just only 1.2%. |
DOI | 10.1109/PVSC40753.2019.8981291 |
ISSN | 0160-8371 |