Department   Undergraduate School  , School of Science and Technology
   Position   Associate Professor
Date 2016/11
Presentation Theme Thermal Strain Measurement of Electronic Package Using Digital Image Correlation with Periodical Error Elimination
Conference 11th International Symposium on Advanced Science and Technology in Experimental Mechanics
Conference Type International
Presentation Type Speech (General)
Contribution Type Collaborative
Country Viet Nam
Venue Ho Chi Minh
Publisher and common publisher Y. Fujimoto, S. Arikawa, M. Murata and S. Yoneyama