Department   Undergraduate School  , School of Science and Technology
   Position   Associate Professor
Date 2013/06
Presentation Theme Observation of Thermal Strain on Electronic Packages Using Digital Image Correlation
Conference SEM 2013 Annual Conference & Exposition on Experimental and Applied Mechanics
Conference Type International
Presentation Type Speech (General)
Contribution Type Collaborative
Venue Lombard
Publisher and common publisher Y. Tominaga, S. Arikawa, S. Yoneyama, Y. Fujimoto and Y. Omoto