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ARIKAWA SHUICHI
Department Undergraduate School , School of Science and Technology Position Associate Professor |
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| Date | 2015/09 |
| Presentation Theme | Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation |
| Conference | International Conference on Advanced Technology in Experimental Mechanics 2015 |
| Conference Type | International |
| Presentation Type | Speech (General) |
| Contribution Type | Collaborative |
| Venue | Toyohashi |
| Publisher and common publisher | Y. Fujimoto, S. Arikawa, R. Yoshida, Y. Omoto and S. Yoneyama |