Department   Undergraduate School  , School of Science and Technology
   Position   Associate Professor
Date 2015/09
Presentation Theme Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation
Conference International Conference on Advanced Technology in Experimental Mechanics 2015
Conference Type International
Presentation Type Speech (General)
Contribution Type Collaborative
Venue Toyohashi
Publisher and common publisher Y. Fujimoto, S. Arikawa, R. Yoshida, Y. Omoto and S. Yoneyama